Modelling of Integrated Circuit Packages and Electromagnetic Coupling to Interconnects

doctoral thesis

• Title (croatian): Modeliranje pakiranja integriranih sklopova i elektromagnetske sprege s prospojnim linijama
• Author: Tvrtko Mandić
• Mentor: Adrijan Barić (mentor)
• Mentor: Bart Nauwelaers (komentor); strani drzavljanin: Nije dostupno
• Committee member: Juraj Bartolić (predsjednik povjerenstva)
• Committee member: E. Van Lil (član povjerenstva); strani drzavljanin: Nije dostupno
• Committee member: G.A.E. Vandenbosch (član povjerenstva); strani drzavljanin: Nije dostupno
• Committee member: Zvonimir Šipuš (član povjerenstva)
• Committee member: R. Gillon (član povjerenstva); strani drzavljanin: Nije dostupno
• Granter: University of Zagreb; Faculty of Electrical Engineering and Computing; (Department of Electronics, Microelectronics, Computer and Intelligent Systems); Zagreb
• Defense date and country: 2013-02-27, Croatia
• Scientific / art field, discipline and subdiscipline: TECHNICAL SCIENCES; Electrical Engineering
• Universal decimal classification (UDC): 621.3 - Electrical engineering

Abstract

In recent years, due to an increasing level of electromagnetic (EM) pollution, the electronic circuits are confronting rising demands on electromagnetic compatibility (EMC). Since EMC has become one of the major causes of printed circuit board (PCB) and integrated circuit redesign, the prediction of the EM field interference is of great importance. Standardized EMC tests enable the assessment of the compliance of electronic circuits to the imposed norms. Inability of the electronic circuit to... More comply with the standards may result in significant increase of production cost and time to market. The goal of this research is to enable circuit simulations of EMC pre-compliance tests of critical elements of electronic circuits, i.e. interconnects. The development of circuit models of the EM coupling to interconnects enables identification of possible radiated EMC issues during the circuit design flow and consequently decrease the production cost and increase system reliability. The TEM cell and IC-Stripline present the standard methods for the radiated emission and immunity pre-compliance EMC tests. In this work, the TEM cell and IC-Stripline equivalent circuit models are developed as well as the circuit models of EM field coupling to the printed circuit board traces. The interconnects considered in this work are IC packages and transmission lines. The response surface methodology based on EM simulations is used to build scalable circuit models of IC packages. The broadband modelling of SMA connectors and transmission lines is performed. The accuracy of the developed circuit models is very good and the models present a significant step towards reliable circuit simulations of the complex electronic system pre-compliance EMC tests. Less

Abstract (croatian)

Današnji elektronički sklopovi imaju stroge kriterije za elektromagnetsku (EM) kompatibilnost pa je stoga od velikog značaja mogućnost predviđanja sprege EM polja s elementima elektroničkog sklopa. Standardizirani testovi vezani uz ispitivanje EM kompatibilnosti omogućavaju ocjenu usklađenosti proizvedenih elektroničkih uređaja s normama propisanima standardima. Ukoliko elektronički uređaj ne zadovolji propisane norme, potrebno je ići u doradu i redizajn uređaja što može uvelike povisiti... More njegovu cijenu. Cilj istraživanja je omogućiti sklopovske simulacije testova EM kompatibilnosti na pojedinim elementima elektroničkog sklopa, tj. prospojima. Razvoj sklopovskih modela EM sprege omogućit će identifikaciju mogućih problema vezanih uz EM radijaciju za vrijeme razvoja uređaja i time smanjiti cijenu proizvodnje te povećati pouzdanost sustava. TEM ćelija i IC-Stripline ćelija predstavljaju standardne metode izvođenja testova EM kompatibilnosti vezanih uz radijaciju i susceptibilnost. Njihovi sklopovski modeli su razvijeni kao i sklopovski model EM sprege. Prospoji koji su obrađeni u ovome radu su pakiranja integriranih sklopova i prijenosne linije. Metoda odzivnih površina temeljena na EM simulacijama korištena je u svrhu razvoja skalabilnih sklopovskih modela pakiranja integriranih sklopova. Također su razvijeni širokopojasni modeli SMA konektora i prijenosnih linija. Točnost razvijenih sklopovskih modela je vrlo dobra što omogućava njihovu primjenu za sklopovske simulacije testova EM kompatibilnosti složenih elektroničkih sustava. Less

• Keywords: integrated circuit package modelling; response surface methodology; electromagnetic simulations; equivalent circuit models; electromagnetic coupling models; transverse electromagnetic (TEM) cell; IC-Stripline; SMA connector models
• Keywords (croatian): modeliranje pakiranja integriranih sklopova; metodologija odzivnih površina; elektromagnetske simulacije; ekvivalentni sklopovski modeli; modeli elektromagnetske sprege; TEM ćelija; IC-Stripline ćelija; modeli SMA konektora
• Language: english
• URN:NBN: urn:nbn:hr:168:952056
• Project: Number: 036-0361621-1622; Title: Kvaliteta signala u integriranim sklopovima s mješovitim signalom; Leader: Adrijan Barić; Jurisdiction: Croatia; Funder: MZOS; Funding stream: ZP
• Study programme: Title: Doctoral study programme "Electrical Engineering and Computing"; Study programme type: university; Study level: postgraduate; Academic / professional title: doktor/doktorica znanosti, po-dručje tehničkih znanosti (doktor/doktorica znanosti, po-dručje tehničkih znanosti)
• Catalog URL: http://lib.fer.hr/cgi-bin/koha/opac-detail.pl?biblionumber=41134
• Type of resource: Text
• Extent: 123 str. ; 30 cm.
• File origin: Born digital
• Access conditions: Closed access
• Created on: 2019-09-17 09:00:57